IT House July 4 news, Samsung Electro-Mechanics announced in late June,An additional 300 billion won (about 1.551 billion yuan) will be invested in the construction of semiconductor packaging substrate (FCBGA) facilities. This investment will be used for FCBGA’s facilities in Busan, South Korea, Sejong Plant, and Vietnam’s production subsidiary.
Samsung Electro-Mechanics said that through this investment, it plans toActively respond to the increased demand for packaging substrates due to the high performance of semiconductors and market growth. In particular, it will realize mass production of packaging substrates for servers within the year for the first time in South Korea, and strengthen its position as the top three in the world by expanding high-end products such as servers, networks, and vehicles.
IT Home understands that the packaging substrate is the substrate that connects the large-scale integrated circuit chip and the motherboard, and transmits electrical signals and currents.Mainly used for CPU (Central Processing Unit) and GPU (Graphics Processing Unit) that require connection of high performance and high density circuits.
▲ Image source: Samsung Electro-Mechanics
Samsung Electro-Mechanics explained that the demand for high-end packaging substrates from the world’s top customer companies is increasing, and the demand for packaging substrates for automotive vehicles is also increasing due to the expansion of autonomous driving.
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