Electronic component manufacturer Samsung Electro-Mechanics started mass production of FC-BGA (Flip Chip-Ball Grid Array) for servers in South Korea for the first time.Indicates the goal to become the world’s third largest IC packaging substrate factory.
According to BusinessKorea, Pulse, Samsung Electro-Mechanics announced that the company’s semiconductor substrate production has continued to increase, from 495,000 square meters in 2019 to 703,000 square meters in 2021, equivalent to 100 football fields. Due to the continued shortage of substrates,The company’s capacity interest rate is approaching 100%.
FC-BGA is a high-end substrate with extremely high technical difficulty. Samsung Electro-Mechanics said it will expand production of high-end products,The goal is to become the third largest manufacturer of semiconductor substrates, second only to the Japanese factory Ibiden and the new optoelectronics. In the next five years, the FC-BGA market size is expected to grow by more than 10% per year, and the market value will rise from $11.3 billion to $17 billion in 2026. Ahn Jung-hoon, director of Samsung Electro-Mechanics, said that although the semiconductor substrate market is smaller than that of foundry, its growth potential is far greater than that of foundry.
So far this year, Samsung Electro-Mechanics has invested 300 billion won ($227 million) in a South Korean production line to produce next-generation substrates. Over the past two years, the company has spent 2 trillion won to expand FC-BGA production facilities.
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