Japanese auto parts supplier DensoDeveloped a power semiconductor device for electric vehicles,Can reduce power loss by 20%.
According to the Nikkei Asian Review, Denso’s new RC-IGBT integrates a diode into a power semiconductor device called an insulated gate bipolar transistor,About 30% smaller than existing products on the market, while also reducing power loss.
▲ Source: Nikkei Asian Review
It is reported that Denso will be in the period from fiscal year 2019 to fiscal year 2021.160 billion yen of capital investment in chip-related fieldsand will continue to increase investment.
Separately, Denso announced in April that it had partnered with Taiwan-based contract chip maker UMC to produce power semiconductors on 300mm wafers at UMC’s Japanese manufacturing facility as early as next year. Larger wafers can increase productivity, compared to standard 200mm wafers,Denso sees a cost reduction of about 20%.
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